3 Most Popular Wafer Dicing Techniques

What is Wafer Dicing?

Wafer dicing is one of the first steps in micro assembly.  Simply put, this is the process of separating dice i-e small chips of semiconducting material from a semiconductor wafer. The dice can be separated in a variety of ways. This can be done through scribing, cutting, or wax mounting. Basically, the dice is separated by sawing wafer between extra spaces.

Typically, water free dicing services are used for separating optical components or electronics imaged onto wafers. To minimize chipping, the substrate (i-e board holding circuit) can be waxed onto hard mounts. Professional dicing experts can then cut them with precision, to be grooved and aligned in microscopic patterns.

Wafers are mounted onto tape for an improved backside support. After mounting the wafer, they are loaded into dicing mechanism through a cassette, which then slices the wafer into individual dice. The dicing mechanism is a high speed rotating abrasive blade with a speed of usually 30,000–60,000 rpm. Precise cutting is possible because of sharp edged blade which usually has diamond grit embedded into an electroplated nickel matrix. Diamond is the hardest material, allowing crushing of wafers with ease. During cutting, the debris produced has to be continuously removed with the help of machines, so as not to compromise the process of water free dicing services. The dedicated lines between active areas through which the blade moves are known as streets, creating a groove in the substrate material.

Wafer Dicing Techniques

1. Wafer Scribing 

Scribing refers to technique used for separating one slice. In this technique only one process tool is used for partially cutting through a wafer, in form of scribed lines. After this, the wafer is broken along the demarcated scribed lines for separating individual dice. Scribing is different than other methods of water free dicing services because they involve direct cutting through a wafer, in just one step.

2. Through Cutting

When wafers are cut completely on tape, the tolerance in separated chip is higher than the one achieved through scribing. However, the only drawback in whole cutting process is that while water free dicing services, the substrate can also be chipped. This can be avoided by wax mounting wafers onto glass, for accurate and precise cutting.

3. Wax Mounting on glass

Wax mounting on glass is laborious process, however it helps in achieving superior quality water free dicing services. To carry out this process, manufacturers must clean the work pieces before starting the actual process. This allows in achieving the best possible edge quality. Since a substrate is wax mounted on glass, therefore no bottom-side gets chipped off because of the support at the bottom. The wax mounting can also be replaced with tape mounting for a simpler process.

Wafer Dicing Services Provider GDSI

At GDSI, dicing work is carried out with expertise and skill. We deal in quartz, alumina, piezoceramics, glass, and layered combinations of a variety of materials. At GDSI, we do not only carry out dice singulations on wafers but also Water Free Dicing Services, cutting grooves and forming surface features.

Our Grinding & Dicing Services Company staff is a reputable Wafer Dicing Service Provider, which uses multiple dicing machines to carry out precise dicing as per clients’ requirements. By listening to clients, our qualified team of engineers not only understands the individual needs of each client, rather perform the job in accordance with your business goals. To learn more about GDSI Ceramics’ wafer dicing services, contact us today.

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Christophe Rude

Christophe Rude

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